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A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures
Byunghoon Lee, Haseok Jeon, Seong-Jae Jeon, Kee-Won Kwon, Hoo-Jeong LeeVolume:
41
Language:
english
Pages:
6
DOI:
10.1007/s11664-011-1759-x
Date:
January, 2012
File:
PDF, 535 KB
english, 2012