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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Payam Darbandi, Farhang Pourboghrat, Tae-Kyu Lee, Kuo-Chuan LiuVolume:
41
Language:
english
Pages:
19
DOI:
10.1007/s11664-011-1811-x
Date:
February, 2012
File:
PDF, 2.73 MB
english, 2012