[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Shear strength and fracture behavior of locally-melted hybrid Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu joints under different loading rates

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