Reliability of a flip-chip package thermally loaded between...

Reliability of a flip-chip package thermally loaded between −55°C and 125°C

Elizabeth S. Drexler
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Volume:
28
Year:
1999
Language:
english
Pages:
8
DOI:
10.1007/s11664-999-0150-7
File:
PDF, 687 KB
english, 1999
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