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Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy
Noboru Wade, Tatsuo Akuzawa, Seiji Yamada, Daigo Sugiyama, Ick-Soo Kim, Kazuya MiyaharaVolume:
28
Year:
1999
Language:
english
Pages:
4
DOI:
10.1007/s11664-999-0169-9
File:
PDF, 333 KB
english, 1999