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The effects of underfill on the reliability of flip chip solder joints
Peng Su, Sven Rzepka, Matt Korhonen, C. Y. LiVolume:
28
Year:
1999
Language:
english
Pages:
6
DOI:
10.1007/s11664-999-0178-8
File:
PDF, 505 KB
english, 1999