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Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis
P. T. Vianco, J. A. RejentVolume:
28
Year:
1999
Language:
english
Pages:
11
DOI:
10.1007/s11664-999-0250-4
File:
PDF, 2.28 MB
english, 1999