On the Issue of Crack Formation in a Thin Dielectric Layer...

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Journal of Materials Engineering and Performance 2020 / 7

On the Issue of Crack Formation in a Thin Dielectric Layer on Silicon under Thermal Shock

Skvortsov, Arkadiy A., Koryachko, Marina V., Skvortsov, Pavel A., Luk’yanov, Mikhail N.
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Journal:
Journal of Materials Engineering and Performance
DOI:
10.1007/s11665-020-04925-4
Date:
July, 2020
File:
PDF, 902 KB
2020
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