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Metals and Materials International 2020 / 4

Transient Liquid Phase Bonding Process Using Sn-coated Cu Dendritic Particles

Hwang, Jun Ho, Lee, Jong-Hyun
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Journal:
Metals and Materials International
DOI:
10.1007/s12540-020-00702-z
Date:
April, 2020
File:
PDF, 1.74 MB
2020
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