Quasi-3D Thermal Simulation of Integrated Circuit Systems...

Energies 2020 / 06 Vol. 13; Iss. 12

Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages

Petrosyants, Konstantin O., Ryabov, Nikita I.
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Volume:
13
Journal:
Energies
DOI:
10.3390/en13123054
Date:
June, 2020
File:
PDF, 8.26 MB
2020
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