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Investigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D/2.5D Heterogeneous Integration
Chou, Tzu-Chieh, Yang, Kai-Ming, Li, Jian-Chen, Yu, Ting-Yang, Yang, Yu-Tao, Hu, Han-Wen, Liu, Yu-Wei, Ko, Cheng-Ta, Chen, Yu-Hua, Tseng, Tzyy-Jang, Chen, Kuan-NengYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.3004969
File:
PDF, 1.71 MB
2020