[IEEE 2020 IEEE International Reliability Physics Symposium (IRPS) - Dallas, TX, USA (2020.4.28-2020.5.30)] 2020 IEEE International Reliability Physics Symposium (IRPS) - Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects
Kim, Yi Ram, Osmanson, Allison T., Madanipour, Hossein, Kim, Choong-Un, Thompson, Patrick F., Chen, QiaoYear:
2020
DOI:
10.1109/IRPS45951.2020.9129337
File:
PDF, 872 KB
2020