Effect of Electroless Ni-P Plating on the Bonding Strength...

Effect of Electroless Ni-P Plating on the Bonding Strength of PbTe Thermoelectric Module Using Silver Alloy-Based Brazing

Bae, Sung Hwa, Choi, Joon Young, Son, Injoon
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Volume:
985
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.985.16
Date:
April, 2020
File:
PDF, 683 KB
2020
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