Correlation between electromigration-related void volumes...

Correlation between electromigration-related void volumes and time-to-failure, the high-resolution x-ray tomography’s vital support

Moreau, Stéphane, Fraczkiewicz, Alexandra
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Volume:
38
Journal:
Journal of Vacuum Science & Technology B
DOI:
10.1116/6.0000252
Date:
July, 2020
File:
PDF, 1.94 MB
2020
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