Gate leakage current reduction and improved reliability...

Thin Solid Films 2020 / 08 Vol. 708

Gate leakage current reduction and improved reliability with an ultra-thin Ti layer for low-power applications

Park, Jungmin, Choi, Pyungho, Kim, Soonkon, Kang, Heesung, Ku, Jahum, Choi, Byoungdeog
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
708
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2020.138102
Date:
August, 2020
File:
PDF, 1.32 MB
2020
Conversion to is in progress
Conversion to is failed