High bond strength Cu joints fabricated by rapid and...

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Materials Letters 2020 / 7

High bond strength Cu joints fabricated by rapid and pressureless in situ reduction-sintering of Cu nanoparticles

Zuo, Yang, Carter-Searjeant, Sadie, Green, Mark, Mills, Liam, Mannan, Samjid H.
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Journal:
Materials Letters
DOI:
10.1016/j.matlet.2020.128260
Date:
July, 2020
File:
PDF, 619 KB
2020
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