Panel-Level Fan-Out RDL-first Packaging for Heterogeneous Integration
Lau, John H, Ko, Cheng-Ta, Yang, Kai-Ming, Peng, Chia-Yu, Xia, Tim, Lin, Puru Bruce, Chen, JJ, Huang, Po-Chun, Liu, Hsing Ning, Tseng, Tzvy-Jang, Lin, Eagle, Chang, LeoYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.2996658
File:
PDF, 2.55 MB
2020