[IEEE 2019 3rd International Conference on Electronic...

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[IEEE 2019 3rd International Conference on Electronic Information Technology and Computer Engineering (EITCE) - Xiamen, China (2019.10.18-2019.10.20)] 2019 3rd International Conference on Electronic Information Technology and Computer Engineering (EITCE) - Development of Press-pack IGBT Chip for good SOA Capability

Li, Li, Jin, Rui, Wang, Yaohua, Gao, Mingchao, Wu, Junmin, Pan, Yan
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Year:
2019
DOI:
10.1109/EITCE47263.2019.9095079
File:
PDF, 1.96 MB
2019
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