Growth of intermetallic compounds in solder joints based on...

Microelectronics Reliability 2020 / 04 Vol. 107

Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory

Zhipeng, Zhao, Xiaomin, Zhang, Shulin, Tan, Zhouzhi, Wu, Hengjia, Zhang
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Volume:
107
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113621
Date:
April, 2020
File:
PDF, 3.07 MB
2020
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