Effect of adding Ce on interfacial reactions between...

Journal of Central South University 2008 / 06 Vol. 15; Iss. 3

Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

Bin Lu, Hui Li, Juan-hui Wang, Hua-wei Zhu, Xian-he Jiao
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Volume:
15
Language:
english
Pages:
5
DOI:
10.1007/s11771-008-0059-y
Date:
June, 2008
File:
PDF, 933 KB
english, 2008
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