Microstructural and shear strength properties of...

Journal of Materials Science: Materials in Electronics 2020 / 6 Vol. 31; Iss. 11

Microstructural and shear strength properties of RHA-reinforced Sn–0.7Cu composite solder joints on bare Cu and ENIAg surface finish

Hanim, M. A. Azmah, Kamil, N. Muhamad, Wei, Chuan Khang, Dele-Afolabi, T. T., Azlina, O. Saliza
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Volume:
31
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-03367-x
Date:
June, 2020
File:
PDF, 3.94 MB
2020
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