Disbond detection with piezoelectric wafer active sensors...

Earthquake Engineering and Engineering Vibration 2003 / 12 Vol. 2; Iss. 2

Disbond detection with piezoelectric wafer active sensors in RC structures strengthened with FRP composite overlays

Victor Giurgiutiu, Kent Harries, Michael Petrou, Joel Bost, Josh B. Quattlebaum
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Volume:
2
Pages:
11
DOI:
10.1007/s11803-003-0005-9
Date:
December, 2003
File:
PDF, 416 KB
2003
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