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Thin film silver deposition by electroplating for ULSI interconnect applications
Joon-Mo Seo, Sung Ki Cho, Hyo-Chol Koo, Soo-Kil Kim, Oh Joong Kwon, Jae Jeong KimVolume:
26
Language:
english
Pages:
4
DOI:
10.1007/s11814-009-0045-6
Date:
January, 2009
File:
PDF, 605 KB
english, 2009