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Creep properties of Sn-Ag solder joints containing intermetallic particles
S. Choi, J. G. Lee, F. Guo, T. R. Bieler, K. N. Subramanian, J. P. LucasVolume:
53
Year:
2001
Language:
english
Pages:
5
DOI:
10.1007/s11837-001-0098-4
File:
PDF, 3.43 MB
english, 2001