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Solid-liquid reactions: The effect of Cu content on Sn-Ag-Cu interconnects
Henry Y. Lu, Haluk Balkan, K. Y. SimonVolume:
57
Language:
english
Pages:
6
DOI:
10.1007/s11837-005-0133-y
Date:
June, 2005
File:
PDF, 1.52 MB
english, 2005