An overview of Pb-free, flip-chip wafer-bumping...

An overview of Pb-free, flip-chip wafer-bumping technologies

Sung K. Kang, Peter Gruber, Da-Yuan Shih
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Volume:
60
Language:
english
Pages:
5
DOI:
10.1007/s11837-008-0075-2
Date:
June, 2008
File:
PDF, 697 KB
english, 2008
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