Impact of processing conditions and solder materials on...

Impact of processing conditions and solder materials on surface mount assembly defects

Rajen S. Sidhu, Raiyo Aspandiar, Steve Vandervoort, Dudi Amir, Gregorio Murtagian
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Volume:
63
Language:
english
Pages:
5
DOI:
10.1007/s11837-011-0174-3
Date:
October, 2011
File:
PDF, 1.16 MB
english, 2011
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