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Microstructure formation in Sn-Cu-Ni solder alloys
M. Felberbaum, T. Ventura, M. Rappaz, A. K. DahleVolume:
63
Language:
english
Pages:
4
DOI:
10.1007/s11837-011-0175-2
Date:
October, 2011
File:
PDF, 868 KB
english, 2011