Modeling of anodic bonding with SiO 2 dielectric as interlayer
Gao, Chengwu, Yang, Fang, Zhang, DachengVolume:
30
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/ab9d2c
Date:
October, 2020
File:
PDF, 2.29 MB
2020