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[IEEE 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Lyon, France (2020.6.15-2020.6.26)] 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Preparation of Germanium-on-insulator (GOI) wafers by means of layer transfer tehnique
Lisker, Marco, Kruger, Andreas, Kruger, Patrick, Voss, Thomas, Lukose, Rasuole, Yamamoto, Yuji, Fursenko, Oksana, Wietstruck, Matthias, Kaynak, MehmetYear:
2020
DOI:
10.1109/DTIP51112.2020.9139149
File:
PDF, 469 KB
2020