[IEEE 2020 Symposium on Design, Test, Integration &...

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[IEEE 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Lyon, France (2020.6.15-2020.6.26)] 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - New High Efficiency Heater Design for a 3-axis CMOS MEMS Convective Accelerometer

Abdellatif, Sonia, Mezghani, Brahim, Mailly, Frederick, Nouet, Pascal
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Year:
2020
DOI:
10.1109/DTIP51112.2020.9139152
File:
PDF, 1016 KB
2020
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