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Effect of Different PBO-Based RDL Structures on Chip-Package Interaction Reliability of Wafer Level Package
Qin, Chong, Li, Yi, Mao, HaiyangYear:
2020
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2020.3004836
File:
PDF, 996 KB
2020