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The Effect of the Electrodeposition Time on CuCl Anode from the Waste Copper Etchant
Hou, Hongying, Zhu, Jing, Meng, Kun, Wang, Lei, Qiu, JinxuJournal:
Surface Innovations
DOI:
10.1680/jsuin.20.00007
Date:
February, 2020
File:
PDF, 1.29 MB
2020