Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
Wang, Wengan, Zou, Guisheng, Jia, Qiang, Zhang, Hongqiang, Feng, Bin, Deng, Zhongyang, Liu, LeiJournal:
Materials Science and Engineering: A
DOI:
10.1016/j.msea.2020.139894
Date:
July, 2020
File:
PDF, 1.52 MB
2020
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