A new method of determining the slicing parameters for fixed diamond wire saw
Liu, Tengyun, Ge, Peiqi, Bi, Wenbo, Gao, YufeiVolume:
120
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2020.105252
Date:
December, 2020
File:
PDF, 5.19 MB
2020