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Improved sinterability of micro-scale copper paste with a reducing agent
Kwon, Soonyong, Lee, Tae-Ik, Lee, Hoo-Jeong, Yoo, SehoonVolume:
269
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2020.127656
Date:
June, 2020
File:
PDF, 891 KB
2020