The filling seams improvement and properties analyses of tungsten films
Xu, Shaohui, Yao, Pan, Zhang, Jiandong, Huang, RenruiVolume:
226
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2020.111285
Date:
April, 2020
File:
PDF, 1.71 MB
2020