Defect minimization and process improvement in SMT...

Soldering & Surface Mount Technology 2019 / 09 Vol. 32; Iss. 1

Defect minimization and process improvement in SMT lead-free solder paste printing: a comparative study

Asghar, Rafiq, Rehman, Faisal, Aman, Ali, Iqbal, Kashif, Nawaz, Agha Ali
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Volume:
32
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-05-2019-0019
Date:
September, 2019
File:
PDF, 1.96 MB
2019
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