Thermal decomposition of binary mixtures of organic...

Soldering & Surface Mount Technology 2019 / 08 Vol. 32; Iss. 2

Thermal decomposition of binary mixtures of organic activators used in no-clean fluxes and impact on PCBA corrosion reliability

Piotrowska, Kamila, Li, Feng, Ambat, Rajan
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Volume:
32
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-05-2019-0020
Date:
August, 2019
File:
PDF, 4.09 MB
2019
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