Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni...

IOP Conference Series Materials Science and Engineering 2019 / 08 Vol. 585

Spreading and Wetting Behaviors of Sn2.5Ag0.7Cu0.1RE0.05Ni Solder on the Surface of Cu Substrate under Ultrasonic Vibration

Yin, Chenxiang, Zhang, Keke, Li, Shijie, Li, Junheng
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Volume:
585
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/585/1/012024
Date:
August, 2019
File:
PDF, 766 KB
2019
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