Thermal Management Materials for Advanced Heat Sinks used...

IOP Conference Series Materials Science and Engineering 2020 / 06 Vol. 814

Thermal Management Materials for Advanced Heat Sinks used in Modern Microelectronics

Jadhav, S V, Pawar, P M, Wangikar, S S, Bhostekar, N N, Pawar, S T
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Volume:
814
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/814/1/012044
Date:
June, 2020
File:
PDF, 683 KB
2020
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