Stress analysis and structural optimization of 3-D IC...

Soldering & Surface Mount Technology 2019 / 07 Vol. 32; Iss. 1

Stress analysis and structural optimization of 3-D IC package based on the Taguchi method

Xiong, Ming-Yue, Zhang, Liang, He, Peng, Long, Wei-Min
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Volume:
32
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-04-2019-0016
Date:
July, 2019
File:
PDF, 1.71 MB
2019
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