Finite Volume Method Study on Contact Line Jump Phenomena and Dynamic Contact Angle of Underfill Flow in Flip-Chip of Various Bump Pitches
Ng, F C, Abas, A, Abdullah, M ZVolume:
530
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/530/1/012012
Date:
July, 2019
File:
PDF, 1.07 MB
2019