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Comparative analysis of thermal environment between raised-floor and row-based cooling in a campus data center
Jin, Chaoqiang, Bai, Xuelian, An, Yaânan, Zhang, XinVolume:
609
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/609/3/032058
Date:
October, 2019
File:
PDF, 860 KB
2019