Temperature simulation of system-in-package produced with...

IOP Conference Series Materials Science and Engineering 2019 / 10 Vol. 630

Temperature simulation of system-in-package produced with hybrid chip mounting technology

Boriskov, Petr, Ershova, Natalya, Putrolaynen, Vadim, Savitskii, Maxim, Seredov, Pavel, Soloviev, Alexei
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Volume:
630
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899x/630/1/012013
Date:
October, 2019
File:
PDF, 734 KB
2019
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