Entropy of resilience: Formulism and validation using strained-induced surface wettability study on thin film alloys
Wu, Ping, Tan, Boon Teoh, Jeong, Jae-In, Yang, Ji-Hoon, Wu, Shunnian, Anariba, FranklinJournal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.156357
Date:
July, 2020
File:
PDF, 3.36 MB
2020