The formation of intermetallic layer structure of SAC405/Cu...

Soldering & Surface Mount Technology 2020 / 07 Vol. ahead-of-p; Iss. ahead-of-p

The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces

Mohamed Anuar, Rabiatul Adawiyah, Osman, Saliza Azlina
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Volume:
ahead-of-p
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-03-2019-0009
Date:
July, 2020
File:
PDF, 2.83 MB
2020
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