Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies
Nashrudin, Muhammad Naqib, Gan, Zhong Li, Abas, Aizat, Ishak, M.H.H., Tura Ali, M. YusufVolume:
32
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/ssmt-10-2019-0028
Date:
January, 2020
File:
PDF, 2.17 MB
2020