[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules
Tian, Jun, Wang, Congsi, Liu, Shaoyi, Zhu, Cheng, Zhou, Cheng, Liu, Jing, Wang, Zhihai, Yu, Kunpeng, Wang, Lu, Zheng, Yuanpeng, Gao, Wei, Shi, Yu, Xu, QianYear:
2019
DOI:
10.1109/icept47577.2019.245165
File:
PDF, 3.19 MB
2019