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[IEEE 2019 International SoC Design Conference (ISOCC) - Jeju, Korea (South) (2019.10.6-2019.10.9)] 2019 International SoC Design Conference (ISOCC) - A Hardware-efficient TSV Repair Scheme Based on Butterfly Topology
Cheng, Minho, Lim, Hyunyul, Kim, Taehyun, Kang, SunghoYear:
2019
DOI:
10.1109/isocc47750.2019.9078496
File:
PDF, 443 KB
2019